San Ramon, CA – February 17, 2026 – GSOC Solutions, a leading innovator in semiconductor infrastructure, is proud to announce its participation in the Physical AI Chiplet Ecosystem (P.A.C.E.) program [1]. Alongside industry leaders, GSOC aims to foster a robust chiplet ecosystem specifically tailored for the demanding Physical AI market [2].
Accelerating the Physical AI Market
The P.A.C.E. Alliance was launched to break down the “Chiplet Wall”—the high development costs and long time-to-market that have historically hindered wider chiplet adoption [2]. By uniting industry leaders, the program provides a library of interoperable IP blocks and finished chiplets, enabling system designers to develop custom solutions faster and more cost-effectively [1].
“GSOC Solutions is proud to announce its participation in the PACE Chiplet program. Alongside industry leaders, GSOC aims to foster a robust chiplet ecosystem specifically tailored for the demanding Physical AI market,” stated Itai Nadler, CEO of GSOC Solutions [1]. “To support this mission, GSOC has expanded its Ocean™ platform to deliver a comprehensive, configurable chiplet infrastructure.”
The Ocean™ Platform: A Scalable Infrastructure
To support the P.A.C.E. mission, GSOC has expanded its Ocean™ platform to deliver a comprehensive, configurable chiplet infrastructure. As part of the P.A.C.E. program, GSOC now offers a family of system management chiplets fully aligned with Open Compute Project (OCP) standards.
These solutions are highly scalable, providing a seamless path from low-cost, small-footprint designs to high-end, complex System-in-Package (SiP) architectures. By leveraging the P.A.C.E. ecosystem, GSOC will provide management, compute, and chiplet management IP, saving customers millions in redundant Non-Recurring Engineering (NRE) and mask costs [2].
About P.A.C.E.
The Physical AI Chiplet Ecosystem (P.A.C.E.) is a collaborative ecosystem providing interoperable IP blocks and finished chiplets for the Physical AI market. Founding partners include YorChip, QuickLogic, Dolphin Technology, Everspin Technologies, Blumind, and GSOC Solutions [1]. The program enables system and ASIC customers to develop and prototype their own custom chiplets, significantly reducing time-to-market and development costs [2].
For more information about the P.A.C.E. initiative, visit pacechiplets.com
References
[1]: https://www.einpresswire.com/article/892834835/yorchip-and-partners-launch-physical-ai-chiplet-ecosystem-p-a-c-e “EIN Presswire. “YorChip and Partners launch Physical AI Chiplet Ecosystem (P.A.C.E. ).” February 17, 2026.”