GSOC Solutions Takes the Stage at OCP EMEA Summit 2026 to Champion Multi-Vendor Chiplet Interoperability
Barcelona, Spain — April 29-30, 2026
GSOC Solutions, a leader in driving semiconductor innovation, recently presented at the Open Compute Project (OCP) EMEA Summit 2026 in Barcelona. The event, themed “Leading the Future of AI,” brought together over 2,100 global technical leaders to address critical challenges in data center infrastructure and artificial intelligence.
At the summit, GSOC Solutions joined forces with Openchip to deliver a compelling presentation titled “Standardizing System-Level Interoperability for Multi-Vendor Chiplets.” Fady Dahoud, Director of SOC Platform at GSOC Solutions, represented the company on stage alongside Gilberto Rodríguez, VP of Business Development at Openchip.
The Holy Grail of Semiconductor Design: Multi-Vendor Chiplets
The semiconductor industry is undergoing a paradigm shift towards chiplet-based architectures. However, as highlighted in the presentation, the “holy grail” of this transition is achieving true multi-vendor interoperability. While physical interface standards like UCIe and BoW are essential, they are merely the foundation.
“Key enabler for Chiplet markets is the ability for chiplets from different vendors to work together,” the presentation emphasized. To realize an ecosystem of interoperable, composable chiplets, the industry must overcome significant challenges in routing, traffic management, and security control.
A Four-Pillar Solution for System-Level Standards
To address these challenges, GSOC Solutions and Openchip outlined a comprehensive approach focusing on system-level standards. The proposed solution rests on four critical pillars:
| Pillar | Focus Area | Description |
|---|---|---|
| Communication | PHY and Link Layers | Aligning physical and link layers to ensure seamless data movement between diverse chiplets. |
| Management | Cross-Die Protocols | Defining standardized management protocols for critical functions such as boot-up, power, thermal regulation, and performance optimization. |
| Software Layer | Hardware Abstraction | Developing a standardized software stack to abstract hardware complexity, facilitating smooth OS and hypervisor integration. |
| Security | Root of Trust | Establishing a multi-vendor “Root of Trust” for attestation and firmware integrity, ensuring SoC-equivalent security for chiplet systems. |
The presentation can be watched in this link:
YouTube — Standardizing System-Level Interoperability for Multi-Vendor Chiplets
Driving the Open Chiplet Economy (OCE)
The presentation detailed the ongoing efforts within the OCP’s Open Chiplet Economy (OCE) project. The initiative is propelled by two main work streams: the Chiplet System work stream, which focuses on APIs, control protocols, and security; and the FCSA work stream, dedicated to hardware architecture and host-side interfaces.
A key technical highlight was the proposed Chiplet Management Protocol Architecture, built upon the System Control Management Interface (SCMI) concept. This architecture aims to define a standard approach for management among chiplets, utilizing components like the Chiplet Management Interface (CMI) and System Management Controller (SMC).
Furthermore, the presentation stressed the critical importance of security. A chiplet system must provide the same level of security as an equivalent monolithic SoC implementation. The working groups are actively defining security models, identifying threats, and exploring the use of projects like Caliptra as a reference Root of Trust.
GSOC’s Answer: The Ocean™ Chiplet Framework
The challenges discussed at OCP EMEA 2026 are precisely what GSOC Solutions has engineered its flagship platform to address. The Ocean™ Chiplet Family provides a comprehensive, easily customized framework for chiplet development — one that delivers faster time to market, lower development costs, and significantly reduced development risk. By offering a pre-validated, modular system-level scaffold, Ocean™ allows customers to focus their engineering resources on their own differentiating IP rather than solving complex integration problems from scratch. The result is a clear and accelerated path from concept to silicon-proven hardware.
Customers and partners interested in learning more about how the Ocean™ platform can power their next chiplet design are welcome to visit www.gsoc.solutions or contact the GSOC team directly for a consultation.
